For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...
Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, ...
Abstract: This article introduces a novel multiphysics modeling framework for the high-fidelity simulation of superconductors in microwave. The proposed approach integrates the time-dependent Ginzburg ...
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{"meta":{"app":"FEATool Multiphysics","author":"Precise Simulation","build":"1.9.0","date":"19-Feb-2020","descr":["This is an example of modeling anisotropic heat ...
Abstract: This article aims to provide a survey of modeling and simulation of single-event effects (SEEs) in digital electronics at device, circuit, and system levels. It primarily focuses on the ...
Credit: Gorodenkoff/Shutterstock Enhances system-level engineering with expanded digital twin capabilities and connected modeling workflows that deliver deeper real ...
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